Methods of forming semiconductor devices having multiple channel MOS transistors

ABSTRACT

In a method of manufacturing a semiconductor device, a preliminary active pattern including gate layers and channel layers is formed on a substrate. The gate layers and the channel layers are alternatively stacked. A hard mask is formed on the preliminary active pattern. The preliminary active pattern is partially etched using the hard mask as an etching mask to expose a surface of the substrate. The etched preliminary active pattern is trimmed to form an active channel pattern having a width less than a lower width of the hard mask. Source/drain layers are formed on exposed side faces of the active channel pattern and the surface. The gate layers are selectively etched to form tunnels. A gate encloses the active channel pattern and filling the tunnels. Related intermediate structures are also disclosed.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 2003-82824, filed on Nov. 21, 2003, the disclosure ofwhich is incorporated herein by reference as if set forth in itsentirety.

FIELD OF THE INVENTION

The present invention relates to methods of manufacturing semiconductordevices and, more particularly, to methods of manufacturing MOStransistor semiconductor devices.

BACKGROUND OF THE INVENTION

As semiconductor devices become more highly integrated, the size of theactive region of the device on which circuits are formed becomessmaller. As a result, the channel length of a MOS transistor that isformed on the active region is reduced. It will be understood by thosehaving skill in the art that as used herein, the term “MOS” refers toany insulated gate field effect transistor, the gate of which comprisesmetal and/or nonmetal (such as polysilicon) and the insulator of whichcomprises oxide and/or other insulators (such as high dielectricconstant insulators).

As the channel length of the MOS transistor is reduced, the source anddrain may have an increased effect on the electric field/electricpotential in the channel region. This phenomenon is referred to as theshort channel effect. Additionally, when the width of the channel isnarrowed as the size of the active region is reduced, the thresholdvoltage of the MOS transistor may be lowered. This phenomenon isreferred to as a reverse narrow width effect.

Methods for reducing the size of semiconductor devices and for improvingthe performance of such devices have been developed. For example, U.S.Pat. No. 6,413,802 discloses methods for providing a vertical MOStransistor having a fin structure that comprises a plurality of thinchannel fins between a pair of source/drain regions and a gate electrodethat is formed on both sides of the channel fins. U.S. Pat. No.4,996,574 discloses a MOS transistor having a DELTA structure that has achannel layer that includes a vertically protruded portion which issurrounded by a gate electrode. MOS transistor having a gate all around(GAA) structure have also been proposed. In these transistors, an activepattern as an SOI layer may be formed on a substrate. A gate electrodesurrounds the channel region of the active pattern, on which aninsulation layer is formed.

SUMMARY OF THE INVENTION

Pursuant to embodiments of the present invention, methods ofmanufacturing a MOS transistor are provided in which a stacked structurecomprising a first semiconductor layer on a substrate, a secondsemiconductor layer on the first semiconductor layer, a thirdsemiconductor layer on the second semiconductor layer and a fourthsemiconductor layer on the third semiconductor layer is formed. A hardmask pattern is formed on at least a portion of the fourth semiconductorlayer. The first, second, third and fourth semiconductor layers arepartially etched, and then trimmed to form an active pattern thatextends above the upper surface of the substrate and has first andsecond sidewalls that are substantially vertical. A semiconductor layeris grown on the first and second sidewalls of the active pattern to forma pair of source/drain regions, and then portions of the first and thirdsemiconductor layers are selectively etched to form a pair of tunnels inthe active pattern that extend from the front to the rear side of thepattern. A conductive gate is then formed on the top surface of theactive pattern and in the tunnels.

In some embodiments, the first and third semiconductor layers may havean etching selectivity with respect to the second and fourthsemiconductor layers. The trimming process may trim the width of thefirst, second, third and fourth semiconductor layers to a width that isless than the width of a lower surface of the hard mask pattern. Instill other embodiments, a spacer may be formed on opposing sidewalls ofthe hard mask pattern. In these embodiments, the etched first, second,third and fourth semiconductor layers may be trimmed to have a widththat is less than the combined width of a lower surface of the hard maskpattern and the spacer. The trimming may be performed by isotropicallyetching the etched first, second, third and fourth semiconductor layersusing an etchant that has little etching selectivity between the first,second, third and fourth semiconductor layers.

In certain embodiments, the hard mask pattern may have a trapezoidalshape. The method may also include removing the hard mask pattern andthereafter forming spacers on the top surface of the source/drainregions. A gate insulation layer may also be formed on an inner surfaceof each tunnel, on a sidewall of each spacer and on the active pattern.

According to further embodiments of the present invention, methods ofmanufacturing a semiconductor device are provided in which a preliminaryactive pattern is formed on a substrate. The preliminary active patternincludes at least two gate layers and at least two channel layers thatare alternatively stacked. A hard mask may be formed on the preliminaryactive pattern, and then the preliminary active pattern may be partiallyetched using the hard mask as an etching mask. Thereafter, the width ofthe etched preliminary active pattern may be trimmed to form an activechannel pattern, and a semiconductor layer is grown on first and secondexposed sides of the active channel pattern and a top surface of thesubstrate to form source/drain regions. Additionally, the gate layersmay be selectively etched to form tunnels therethrough, and an uppergate is formed on the upper face of the active channel pattern and alower gate is formed on the front and rear sides of the active channelpattern and in the tunnels.

In certain embodiments of these methods, the channel layers and the gatelayers are formed of different materials that have an etchingselectivity with respect to each other, such as silicon and germanium orsilicon-germanium. During formation of the source/drain regions firstimpurities may be implanted into portions of the semiconductor layergrown on the first and second exposed side faces of the active channelpattern and the top surface of the substrate. A top surface portion ofthe substrate that is positioned beneath the lowest gate layer may bedoped with second impurities to form a channel isolation region, wherethe second impurities have a conductivity type that is opposite theconductivity type of the first impurities.

In these methods, the upper width of the hard mask may be less than thelower width of the hard mask. The hard mask may be formed bysuccessively stacking an etch stop layer and a dummy gate layer on thepreliminary active pattern and then partially etching these layers toform a hard mask having a side face inclined to an upper face of thehard mask. A spacer that has an etch selectivity with respect to thedummy gate layer may also be formed on a side face of the hard mask. Thespacer and the etch stop layer may be formed of substantially identicalmaterials.

Pursuant to still further embodiments of the present invention,intermediate structures are provided that are formed during thefabrication of multi-channel MOS transistors. The intermediate structurecomprises an active channel pattern on a substrate, the active channelpattern comprising a first semiconductor layer on the substrate, asecond semiconductor layer on the first semiconductor layer, a thirdsemiconductor layer on the second semiconductor layer and a fourthsemiconductor layer on the third semiconductor layer. The first andthird semiconductor layers have an etching selectivity with respect tothe second and fourth semiconductor layers. A hard mask is provided onthe active channel pattern, where the width of a lower portion of thehard mask exceeds the width of an upper portion of the hard mask.

In certain embodiments of these intermediate structures, the width ofthe active channel pattern may be less than the width of the hard mask.The hard mask may comprise a stacked structure that includes a dummygate pattern on an etch stop layer pattern. The hard mask may have atrapezoidal-shaped cross-section. In other embodiments, the hard maskmay comprise a dummy gate pattern on an etch stop layer pattern, andfirst and second spacers that are provided on sidewalls of the dummygate pattern and the etch stop layer pattern. The active channel patternmay have substantially vertical sidewalls that extend above an uppersurface of the substrate. Source/drain regions may also be provided onthe sidewalls of the active channel pattern. The intermediate structuremay also include an insulation layer on the active channel pattern, thefirst and second semiconductor source/drain regions and the hard mask.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this application, illustrate certain embodiment(s) of theinvention. In the drawings:

FIG. 1A is a perspective view illustrating an active pattern of a MOStransistor having multiple channels in accordance with embodiments ofthe present invention;

FIG. 1B is a perspective view illustrating a gate electrode of the MOStransistor of FIG. 1A;

FIG. 2 is a cross sectional view illustrating the MOS transistor ofFIGS. 1A and 1B;

FIGS. 3A to 3O are cross sectional views illustrating methods ofmanufacturing semiconductor devices in accordance with first embodimentsof the present invention;

FIGS. 4A to 4C are perspective views further illustrating the methods ofmanufacturing semiconductor devices in accordance with the firstembodiments of the present invention; and

FIGS. 5A to 5L are cross sectional views illustrating methods ofmanufacturing semiconductor devices in accordance with secondembodiments of the present invention.

DETAILED DESCRIPTION

Embodiments of the present invention now will be described more fullyhereinafter with reference to the accompanying drawings, in whichembodiments of the invention are shown. This invention may, however, beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein. Rather, these embodiments areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the invention to those skilled in the art.Like numbers refer to like elements throughout.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present invention. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present. Itwill also be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Other words used to describe therelationship between elements should be interpreted in a like fashion(i.e., “between” versus “directly between”, “adjacent” versus “directlyadjacent”, etc.).

Relative terms such as “below” or “above” or “upper” or “lower” or“horizontal” or “vertical” may be used herein to describe a relationshipof one element, layer or region to another element, layer or region asillustrated in the figures. It will be understood that these terms areintended to encompass different orientations of the device in additionto the orientation depicted in the figures. Herein the substrate isdescribed as a lower or the lowest layer of the devices describedherein, but it will be appreciated that the substrate could bepositioned in a different orientation without departing from the scopeof the present invention.

Embodiments of the invention are described herein with reference tocross-section illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of the invention. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the invention should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the figures are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to limit the scope ofthe invention.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used herein, specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIG. 1A is a perspective view illustrating an active pattern 40 of amulti-channel MOS transistor. The active pattern 40 is formed on asemiconductor substrate (not shown), and includes an active channelpattern 36 that has multiple, vertically-disposed, channel regions. Theactive channel pattern 36 has vertical side faces. The active pattern 40also includes source/drain layers 26 that are formed on the side facesof the active channel pattern 36 and a surface of the substrate.

Tunnels 38, which define the channel regions are provided through theactive channel pattern 36. The active channel pattern 36 is doped withN-type impurities or P-type impurities in accordance with the type ofthe transistor. For example, to form an N-type transistor, the activechannel pattern 36 is doped with a low concentration of P-typeimpurities.

In the embodiment depicted in FIG. 1A, two tunnels 38 are formed throughthe active channel pattern 36. A lower gate is formed in each tunnel. Itwill be appreciated by those of skill in the art that a single tunnel 38or three or more tunnels 38 may be included in alternative embodimentsof the present invention.

The source/drain layers 26 are doped with impurities that are theopposite to the impurity type used to dope the channel regions. Forexample, when the transistor is an N-type transistor, the source/drainlayers 26 are doped with N-type impurities.

As shown in FIG. 1A, the active pattern 40 includes a protruded centralportion having an upper face and side faces that are substantiallyperpendicular to the upper face. The tunnels 38 are formed through theprotruded central portion to define the channel regions of thetransistor.

Referring to FIGS. 1B and 2, a gate 50 surrounds the channel regions andextends into, and in some embodiments, fills, the tunnels 38. The gate50 also extends above the upper face of the active pattern 40.

The gate 50 includes a gate insulation layer 42 that is formed on innerfaces of the tunnels 38 and the upper face of the active pattern 40. Thegate insulation layer 42 may comprise, for example, a thermal oxidelayer, an oxide/nitride/oxide (ONO) layer, etc. The gate 50 furtherincludes a conductive layer pattern 44 that is formed on the gateinsulation layer 42. The conductive layer pattern 44 may, for example,comprise a polysilicon and/or metal layer.

Herein, the portion of the gate 50 that extends from the upper face ofthe active pattern 40 is referred to as the upper gate 50 a. Theremaining portions of the gate 50, including the portions formed in thetunnels 38, are referred to as the lower gate 50 b. A metal layer or ametal silicide layer 52 may be formed on an upper face of the upper gate50 a. The layer 52 may facilitate reducing the gate resistance. An oxidespacer 34, such as, for example, a silicon oxide spacer, may be formedon side faces of the upper gate 50 a.

The semiconductor substrate may, for example, comprise a bulk silicon(Si) substrate, a silicon germanium (SiGe) substrate, asilicon-on-insulator (SOI) substrate, a silicon germanium-on-insulator(SGOI) substrate, etc.

When the semiconductor substrate is a bulk silicon substrate, a channelisolation region 12 may be provided beneath the lowest tunnel 38. Thechannel isolation region 12 may comprise a portion of the substrate thatis doped with impurities that are the opposite of the impurities used todope the source/drain layers 26. When the semiconductor substratecomprises an SOI substrate or an SGOI substrate, an insulator may beused to form the channel isolation region 12. The channel isolationregion 12 may reduce or prevent a channel from forming beneath thelowest tunnel 38, thereby reducing the short channel effect.

The active channel pattern 36 may comprise a single crystallinesemiconductor layer or layers. In embodiments of the present invention,the active channel pattern 36 comprises a single crystalline siliconlayer(s). The source/drain layers 26 may be a single crystallinesemiconductor layer, such as, for example, a silicon layer.Additionally, the metal layer or metal silicide layer 52 (see FIG. 2)may also be formed on surfaces of the source/drain layers 26 to reducethe resistance of the source/drain regions 26.

In certain embodiments of the present invention, the source/drain layers26 may have a uniform doping profile in a direction substantiallyperpendicular to the length direction of the channel regions.Accordingly, although the length of the channel regions is increased, arelatively uniform source/drain junction capacitance may be maintained.As a result, the speed of the semiconductor device may be improved byincreasing the current and reducing the junction capacitance.

Hereinafter, methods of manufacturing a semiconductor device inaccordance with some embodiments of the present invention are discussedin detail.

FIGS. 3A to 3O are cross sectional views that illustrate methods ofmanufacturing a semiconductor device in accordance with certainembodiments of the present invention. FIGS. 4A to 4C are perspectiveviews which further illustrate these methods of manufacturing asemiconductor device.

Referring to FIG. 3A, a semiconductor substrate 10 is provided. Thesemiconductor substrate 10 may, for example, comprise a bulk siliconsubstrate, a silicon-germanium substrate, a silicon-on-insulatorsubstrate, a silicon-germanium-on-insulator substrate or various othersubstrates.

As shown in FIG. 3A, impurities may be implanted into the surface of thesemiconductor substrate 10 to form a channel isolation region 12. Theseimpurities are of a conductivity type that is the opposite of theconductivity type of the impurities that are implanted into thesource/drain regions of the transistor. The channel isolation region 12may serve to reduce and/or minimize the short channel effect intransistors formed on bulk semiconductor substrates.

When the semiconductor substrate 10 comprises a bulk silicon substrateor a silicon germanium substrate, the process for forming the channelisolation region 12 may be performed. However, when the semiconductorsubstrate 10 comprises a silicon-on-insulator substrate or asilicon-germanium-on-insulator substrate, the process for forming thechannel isolation region 12 may be omitted and the insulator may be usedas the channel isolation region.

Referring to FIG. 3B, gate layers 14 and channel layers 16 arealternatively formed on the semiconductor substrate 10. In someembodiments, a first gate layer 14 a is formed on the substrate 10, anda first channel layer 16 a is formed on the first gate layer 14 a. Asecond gate layer 14 b is then formed on the first channel layer 16 a,and a second channel layer 16 b is formed on the second gate layer 14 b.

In certain embodiments of the present invention, the channel layers 16a, 16 b may comprise a first single crystalline semiconductor materialand the gate layers 14 a, 14 b may comprise a second single crystallinesemiconductor material that has an etching selectivity with respect tothe first single crystalline semiconductor material. By way of example,the channel layers 16 a, 16 b may comprise silicon layers having athickness of about 300 Å and the gate layers 14 a, 14 b may comprisegermanium layers or silicon-germanium layers having a thickness of about300 Å. In alternative embodiments, the channel layers 16 a, 16 b and thegate layers 14 a, 14 b may be formed by an epitaxial growth process andmay be formed of materials that may or may not have etch selectivitywith respect to each other.

The thickness and the number of the channel layers 16 a, 16 b and gatelayers 14 a, 14 b may be varied. In the present embodiment, the entirethickness of the channel layers 16 a, 16 b and the gate layers 14 a, 14b is about 1,000 Å to about 1,500 Å. The channel layers 16 a, 16 b maybe doped, for example, by implanting impurities or by forming thechannel layers 16 a, 16 b using doped single crystalline silicon layers.

Referring to FIG. 3C, the channel layers 16 a, 16 b, the gate layers 14a, 14 b and portions of the substrate 10 under the channel isolationregion 12 are etched to form an isolation trench. An oxide layer maythen be formed on the second channel layer 16 b and in the isolationtrench. The oxide layer is planarized to expose a surface of the secondchannel layer 16 b using, for example, a chemical mechanical polishing(CMP) process or an etch-back process to form field oxide layers 18defining an active region and a field region. The planarization processalso forms a preliminary active pattern that includes the gate layers 14a, 14 b and the channel layers 16 a, 16 b. The active region may have anisland pattern.

Referring to FIG. 3D, an etch stop layer (not shown) is formed on thesecond channel layer 16 b. A dummy gate layer (not shown) is formed onthe etch stop layer.

The etch stop layer may comprise an insulation material such as siliconnitride that has an etch selectivity with respect to the dummy gatelayer. In embodiments of the present invention, the etch stop layer mayhave a thickness of about 100 Å to about 200 Å. The etch stop layer mayreduce or prevent etching of the second channel layer 16 b during theprocess that etches the dummy gate layer. The dummy gate layer may beused to define a gate region. The dummy gate layer may comprise, forexample, a silicon oxide layer having a thickness of about 1,000 Å toabout 3,000 Å.

The dummy gate layer and the etch stop layer are subsequently etchedusing, for example, a dry etch process to form a gate hard mask 20 thatincludes an etch stop layer pattern 20 a and a dummy gate pattern 20 b.The etching process may be performed so as to provide the etch stoplayer and the dummy gate layer with sloped sides. As a result, the gatehard mask 20 may have a trapezoidal cross-section that has a lower sidewhich is wider than the upper side.

Referring to FIG. 3E, the preliminary active pattern may be etched usingthe gate hard mask 20 as an etching mask. This etching process may beused to expose a portion of the substrate 10 and to form channel layerpatterns 16 a′ 16 b′ and gate layer patterns 14 a′, 14 b′. Portions ofthe substrate may be etched so that the channel isolation region 12extends above the top surface of the remainder of the substrate 10 inthe active region.

Referring to FIG. 3F, the channel layer patterns 16 a′, 16 b′ and thegate layer patterns 14 a′, 14 b′ may be isotropically etched to form anactive channel pattern 24. The active channel pattern 24 may have awidth that is less than the width of the etched preliminary activepattern. The isotropic etching process is referred to as a trimmingprocess because the channel length may be determined through theisotropic etching process.

To form the vertical side profile of the active channel pattern 24, theisotropic etching process may be carried out using an etching gas thathas little etching selectivity between the channel layer patterns 16 a′,16 b′ and the gate layer patterns 14 a′, 14 b′. The isotropic etchingprocess may comprise, for example, a chemical dry etching process thatuses radicals in the etching gas. The active channel pattern 24 formedby such a chemical etching process may have a pattern size that is lessthan the pattern size resulting from a photolithography process.

As shown in FIG. 3G, a selective epitaxial single crystalline layer maybe grown to a thickness of, for example, about 300 Å to about 400 Å onthe exposed surface of the semiconductor substrate 10 and sidewalls ofthe active channel pattern 24 to form source/drain layers.

As shown in FIG. 3G, the active channel pattern 24 may have a width thatis less than the lower width of the gate hard mask 20. As a result, theactive channel pattern 24 may be masked by the gate hard mask 20. Whenthe source/drain layers 26 are epitaxially grown from both sides of theactive channel pattern 24, growth of the source/drain layers 26 issuppressed in a direction substantially parallel to both sides of theactive channel pattern 24. Thus, the source/drain layers 26 mostly growin a direction substantially perpendicular to the sides of the activechannel pattern 24. Accordingly, the source/drain layers 26 have aprofile that is substantially perpendicular to the substrate 10. Thismay facilitate formation of a silicide layer on an upper face of thesource/drain layers 26 in a subsequent process.

Impurities may then be implanted into the source/drain layers 26. Theimpurities may be implanted in a slanted direction or a verticaldirection to form doped source/drain regions 26. The impurities may haveuniform concentration.

Referring to FIG. 3H, a silicon nitride layer 30 may be formed on thefield region 18, the source/drain regions 26 and the gate hard mask 20.A top portion of the silicon nitride layer 30 may then be removed by,for example, a CMP process to expose the upper face of the dummy gatepattern 20 b.

Referring to FIG. 3I, the dummy gate pattern 20 b may then be removed.The etch stop layer pattern 20 a may be partially etched to form a gatetrench 32 defining a region in which an upper gate is formed. Here,since the etch stop layer 20 a has a high etching selectivity withrespect to the dummy gate pattern 20 b, the second channel layer pattern16 b′ may not be removed.

As described above, the gate hard mask 20 may have a trapezoidalcross-section. As a result, the upper width of the gate trench 32 isless than the lower width of the gate trench 32.

Referring to FIG. 3J, a silicon oxide layer (not shown) is formed onsidewalls of the silicon nitride layer 30, on the source/drain layers 26and on the second channel layer pattern 16 b″. The silicon oxide layermay then be anisotropically etched to form an inner oxide spacer 34 onthe sidewalls of the gate trench 32.

The inner oxide spacer 34 narrows the width of the gate trench 32 (andhence the length of the upper gate). Since the lower portion of theoxide spacer 34 is thicker than the upper portion, the sidewalls of thegate trench 32 may have a substantially vertical profile. Accordingly,the upper gate has a length that is substantially similar to the lengthof the lower gate.

In further embodiments of the present invention, the impurities may beimplanted into the channel layer pattern 16 a″ and 16 b″ after formingthe inner oxide spacer 34, instead of implanting them in the mannerdescribed above.

As shown in FIG. 4A, at this point in the process the field region 18may be exposed through front and rear sides of the active channelpattern 24. As shown in FIGS. 3K, 4B and 4C, the exposed field region 18may then be partially etched to expose the front and rear sides of theactive channel pattern 24 (see FIG. 4B). The gate layer patterns 14 a″,14 b″ may then be partially removed using, for example, an isotropicetching process, to form tunnels 38 through the active channel pattern24 (see FIG. 4C). An active pattern 40 that includes the active channelpattern 24 having the tunnels 38 and the source/drain layers 26 isformed via this isotropic etching process. The active pattern 40 mayhave a protruded central portion that has vertical sides.

Referring to FIG. 3L, the substrate 10 may then be thermally oxidized toform a gate insulation layer 42. In embodiments of the presentinvention, the gate insulation layer 42 may have a thickness of about 10Å to about 70 Å on inner faces of the tunnels 38, on the silicon nitridelayer 30 and on sidewalls of the inner oxide spacer 34. The gateinsulation layer 42 may comprise, for example, a silicon oxide layer ora silicon oxynitride layer. The substrate 10 may be thermally treated ata high temperature under, for example, a hydrogen atmosphere or an argonatmosphere to improve surface roughness of the exposed layers beforeforming the gate insulation layer 42.

Referring to FIG. 3M, a gate conductive layer 44 is formed to fill thetunnels 38, the etched field region and the gate trench 32. A gate 50that includes the gate insulation layer 42 and the gate conductive layer44 is formed by this process. In embodiments of the present invention,the gate conductive layer 44 may be formed as follows. A conductivelayer (not shown) such as, for example, a polysilicon or metal layer isformed on the gate insulation layer 42 to fill the tunnels 38, theetched field region and the gate trench 32. Portions of the conductivelayer may then be removed by, for example, a CMP process which exposesthe silicon nitride layer 30 and forms the gate conductive layer 44.

The portion of the gate 50 that extends from the upper face of theactive pattern 40 is referred to herein as the upper gate 50 a. Theportion of the gate 50 that are formed in and adjacent the tunnels 38 isreferred to herein as the lower gate 50 b.

As shown in FIG. 3N, the silicon nitride layer 30 may then be removed toform the active pattern 40, the upper gate 50 a and the lower gate 50 b.The upper gate 50 a is positioned on the upper face of the activepattern 40. The lower gate 50 b is disposed in a vertical direction inthe active pattern 40. The oxide spacer 34 is positioned on sidewalls ofthe upper gate 50 a.

Additionally, impurities having a high concentration may be implantedinto the source/drain layers 26 after the silicon nitride layer 30 isremoved.

As shown in FIG. 3O, when polysilicon is used to form the gateelectrode, a metal silicide layer 52 may be partially formed on theupper gate 50 a and the source/drain layers 26. A first portion of themetal silicide layer 52 on the upper gate 50 a may facilitate reducingthe resistance of the upper gate 50 a. A second portion of the metalsilicide layer 52 on the source/drain layers 26 may likewise facilitatereducing the resistances of the source/drain layers 26 and a contactthat is formed by a successive process. The metal silicide layer 52 isnot formed on the sides of the upper gate 50 a due to the oxide spacer34. Thus, a short between the first and second portions of the metalsilicide layer 52 may be prevented.

FIGS. 5A to 5L are cross sectional views illustrating methods ofmanufacturing a semiconductor device in accordance with furtherembodiments of the present invention.

Referring to FIG. 5A, a channel isolation region 112 is formed on asubstrate 110. The substrate 110 may be divided into an active regionand a field region 118 by processes substantially identical to theprocesses that are discussed above with reference to FIGS. 3A to 3C.Impurities may be implanted into the substrate 110 to form channelisolation region 112. A gate layer 114 including first and second gatelayers 114 a, 114 b, and a channel layer 116 including first and secondchannel layers 116 a, 116 b are alternatively stacked on the channelisolation region 112.

The channel layer 116 may comprise a first single crystallinesemiconductor material, and the gate layer 114 may comprise a secondsingle crystalline semiconductor material that has an etchingselectivity with respect to the first single crystalline semiconductormaterial. The channel layer 116 may comprise, for example, a singlecrystalline silicon layer having a thickness of about 300 Å. The gatelayer 114 may comprise, for example, a single crystalline germaniumlayer or a single crystalline silicon-germanium layer having a thicknessof about 300 Å.

The channel layers 116 a, 116 b, the gate layers 114 a, 114 b andportions of the substrate 110 under the channel isolation region 112 arethen etched to form an isolation trench. The isolation trench may befilled with, for example, a silicon oxide layer to divide the substrate110 into the active region and the field region 118. By theabove-described process, a preliminary active pattern including the gatelayer 114 and the channel layer 116 may be formed.

Referring to FIG. 5B, an etch stop layer (not shown) is formed on thesecond channel layer 16 b. A dummy gate layer (not shown) is formed onthe etch stop layer.

The etch stop layer may comprise an insulation material such as, forexample, silicon nitride that has an etching selectivity with respect tothe dummy gate layer. The etch stop layer may have a thickness, forexample, of about 100 Å to about 200 Å. The etch stop layer may be usedto prevent the second channel layer 16 b from being etched during theetching of the dummy gate layer. The dummy gate layer may be used todefine a gate region. The dummy gate layer may comprise, for example, asilicon oxide layer having a thickness of about 1,000 Å to about 3,000Å.

The dummy gate layer and the etch stop layer may then be etched to forma gate hard mask 120 that includes an etch stop layer pattern 120 a anda dummy gate pattern 120 b.

A silicon nitride layer (not shown) may then be formed on the gate hardmask 120 and the second channel layer 116 b. The silicon nitride layermay then be anisotropically etched to form a nitride spacer 122 on thesides of the gate hard mask 120.

As shown in FIG. 5C, the channel layer 116 and the gate layer 114 maythen be etched using the gate hard mask 120 as an etching mask to exposea portion of the substrate 110 and to form a preliminary active pattern124. The preliminary active pattern 124 includes channel layer patterns116 a′, 116 b′ and gate layer patterns 114 a′, 114 b′.

Referring to FIG. 5D, the channel layer patterns 116 a′, 116 b′ and thegate layer patterns 114 a′, 114 b′ may be isotropically etched to forman active channel pattern 128 that has a width that is less than thewidth of the etched preliminary active pattern 124. This isotropicetching process is referred to as a trimming process because a channellength may be determined through the isotropic etching process.

The isotropic etching process may be carried out using an etching gasthat has little etching selectivity between the channel layer pattern116 and the gate layer pattern 114. The isotropic etching process mayinclude a chemical dry etching process using radicals in the etchinggas. The active channel pattern 128 formed by the chemical etchingprocess may have a pattern size that is less than the pattern size thatwould result if a photolithography process was used.

As shown in FIG. 5E, a selective epitaxial single crystalline layer maybe grown to a thickness of about 300 Å to about 400 Å on the exposedsurface of the semiconductor substrate 110 and both sides of the activechannel pattern 128 to form source/drain layers 130. The active channelpattern 128 may have a width that is less than the lower width of thegate hard mask 120 so that the active channel pattern 128 is masked bythe gate hard mask 120. When the source/drain layers 130 epitaxiallygrow from the both sides of the active channel pattern 128, growth ofthe source/drain layers 130 may be suppressed in a directionsubstantially parallel to the both sides of the active channel pattern128.

Impurities may then be implanted into the source/drain layers 130 in,for example, a slant direction or in a vertical direction, to completeformation of the source/drain regions.

A silicon nitride layer 132 may then be formed on the field region 118,the source/drain layers 130 and the gate hard mask 120 to fill the spacebetween the source/drain layers 130 and the field region 118. Portionsof the silicon nitride layer 132 may thereafter be removed by a CMPprocess to expose the upper face of the dummy gate pattern 120 b. Here,since the nitride spacer 122 includes a material substantially identicalto that of the silicon nitride layer 132, the nitride spacer 122 may notbe differentiated from the silicon nitride layer 132.

As shown in FIG. 5F, the dummy gate pattern 120 b may then be removed.The etch stop layer pattern 120 a is partially etched to form a gatetrench 134.

In further embodiments of the present invention, the impurities may notbe implanted into the channel layer patterns 116 a″, 116 b″ in theprocess described above. In such embodiments, the impurities may insteadbe implanted into the channel layer patterns 116 a″, 116 b″ afterforming the gate trench 134.

Referring to FIG. 5G, the exposed field region 112 is partially etchedto expose the front and rear sides of the active channel pattern 128.The gate layer patterns 114 a″, 114 b″ may then be partially removed,for example, by an isotropic etching process to form the tunnels 138through the active channel pattern 128.

An active pattern 142 that includes the active channel pattern 128 withthe tunnels 138 and the source/drain layers 130 is formed by theisotropic etching process. The active pattern 142 includes a protrudedcentral portion having vertical sides that extends from the top surfaceof the substrate 110.

Referring to FIG. 5H, the substrate 110 is thermally oxidized to form agate insulation layer 144 having, for example, a thickness of about 10 Åto about 70 Å. The gate insulation layer 144 may be formed on the innerfaces of the tunnels 138 and on the gate trench 134. A gate conductivelayer 146 is formed that fills the tunnels 138, the etched field region118 and the gate trench 134. A gate 150 including an upper gate 150 a onthe active pattern 142 and a lower gate 150 b horizontally penetratingthrough the active pattern 142 may be formed by the above-describedprocess.

Referring to FIG. 5I, the silicon nitride layer 132 may then bepartially etched to expose a surface of the field region 118 and to forman etched silicon nitride layer 132 a. Thus, the upper gate 150 aextends above the silicon spacer 132 a.

Referring to FIG. 5J, a silicon oxide layer (not shown) is formed onboth sides of the upper gate 150 a and on the etched silicon nitridelayer 132 a. As shown in FIG. 5J, the silicon oxide layer may then beanisotropically etched to form an oxide spacer 152 on both sides of theupper gate 150 a.

Referring to FIG. 5K, the etched silicon nitride layer 132 a may then beremoved to form the active pattern 142, the lower gate 150 bhorizontally disposed in the active pattern 142, and the upper gate 150a on the active pattern 142. The upper gate 150 a is positioned on theupper face of the active pattern 142. The oxide spacer 152 is positionedon the upper gate 150 a. Additionally, impurities may be implanted intothe source/drain layers 26 after removing the silicon nitride layer 130.

As shown in FIG. 5L, when polysilicon is used to form the a gateelectrode, a metal silicide layer 154 may be selectively formed on theupper gate 150 a and the source/drain layers 130.

According to embodiments of the present invention, semiconductor deviceshaving a single active pattern that may include thin channels enclosedby the gate are provided. Since the thin channels are formed in avertical direction, the source/drain regions may occupy a relativelysmaller area within the active region.

The source/drain regions of the devices may also have a doping profilein a vertical direction with respect to the channels so that a junctioncapacitance of the source/drain regions may, in some instances, bemaintained relatively constant regardless of the number and/or the areaof the channels. This may facilitate rapid device operation.

In further embodiments of the present invention, growth of the epitaxiallayer may be suppressed by the trimming process so that the source/drainlayers may have an improved shape. Also, since the active pattern hasthe vertical side profile, the silicide layer may have uniform thicknessso that the resistance of the source/drain layers may be reduced.

Additionally, although not depicted in the figures, it is noted that ahighly-integrated vertical MOS transistor having multiple channels maybe embodied by combining above-mentioned embodiments with each other.

In the drawings and specification, there have been disclosed typicalembodiments of the invention and, although specific terms are employed,they are used in a generic and descriptive sense only and not forpurposes of limitation, the scope of the invention being set forth inthe following claims.

1. A method of manufacturing a semiconductor device, the methodcomprising: forming a stacked structure comprising a first semiconductorlayer on a substrate, a second semiconductor layer on the firstsemiconductor layer, a third semiconductor layer on the secondsemiconductor layer and a fourth semiconductor layer on the thirdsemiconductor layer; forming a hard mask pattern on a portion of thefourth semiconductor layer; partially etching the first, second, thirdand fourth semiconductor layers; trimming the etched first, second,third and fourth semiconductor layers to form an active pattern having afront side, a first sidewall, a second sidewall, a rear side and a topsurface, wherein the active pattern extends above an upper surface ofthe substrate and wherein the first and second sidewalls aresubstantially vertical; growing a semiconductor layer on the first andsecond sidewalls of the active pattern to form a pair of source/drainregions; selectively etching portions of the first and thirdsemiconductor layers to form a pair of tunnels in the active patternthat each extend from the front side of the active pattern to the rearside of the active pattern; and forming a conductive gate on the topsurface of the active pattern and in the tunnels; wherein trimming theetched first, second, third and fourth semiconductor layers comprisestrimming the etched first, second, third and fourth semiconductor layersto have a width that is less than the width of a lower surface of thehard mask pattern.
 2. The method of claim 1, wherein the first and thirdsemiconductor layers have an etching selectivity with respect to thesecond and fourth semiconductor layers.
 3. The method of claim 1,wherein the hard mask pattern has a trapezoidal shape.
 4. The method ofclaim 1, wherein trimming the etched First, second, third and fourthsemiconductor layers comprises isotropically etching the etched first,second, third and fourth semiconductor layers using an etchant that haslittle etching selectivity between the first, second, third and fourthsemiconductor layers.
 5. The method of claim 1, further comprisingremoving the hard mask pattern and thereafter forming spacers on the topsurface of the source/drain regions.
 6. The method of claim 5, furthercomprising forming a gate insulation layer on an inner surface of eachtunnel, on a sidewall of each spacer and on the active pattern.
 7. Themethod of claim 1, wherein forming a conductive gate on the activepattern and filling the tunnels comprises forming a conductive layer onthe top surface of the active pattern, on the front and rear sides ofthe active pattern and filling each tunnel.
 8. The method of claim 1,wherein forming a stacked structure comprising a first semiconductorlayer on a substrate, a second semiconductor layer on the firstsemiconductor layer, a third semiconductor layer on the secondsemiconductor layer and a fourth semiconductor layer on the thirdsemiconductor layer comprises forming a preliminary active pattern onthe substrate, the preliminary active pattern including at least twogate layers and at least two channel layers that are alternativelystacked; wherein forming a hard mask pattern on a portion of the fourthsemiconductor layer comprises forming the hard mask on the preliminaryactive pattern; wherein partially etching the first, second, third andfourth semiconductor layers comprises partially etching the preliminaryactive pattern using the hard mask as an etching mask; wherein trimmingthe etched first, second, third and fourth semiconductor layers to forman active pattern having a front side, a first sidewall, a secondsidewall, a rear side and a top surface comprises trimming the width ofthe etched preliminary active pattern to form the active pattern;wherein growing a semiconductor layer on the first and second sidewallsof the active pattern to form a pair of source/drain regions comprisesgrowing the semiconductor layer on the first sidewall and the secondsidewall of the active pattern and a top surface of the substrate toform the source/drain regions; wherein selectively etching portions ofthe first and third semiconductor layers to form a pair of tunnels inthe active pattern that each extend from the front side of the activepattern to the rear side of the active pattern comprises selectivelyetching the gate layers to form tunnels therethrough; and whereinforming a conductive gate on the top surface of the active pattern andin the tunnels comprises forming an tipper gate on the top surface ofthe active pattern and forming a lower gate, that is electricallyconnected to the tipper gate, on the front side and the rear side of theactive pattern and in the tunnels.
 9. The method of claim 1, wherein thehard mask pattern comprises a dummy gate pattern on an etch stop layerpattern.
 10. The method of claim 8, wherein trimming the width of theetched preliminary active pattern to form the active pattern comprisestrimming the width of the etched preliminary active pattern to have awidth less than a lower width of the hard mask.
 11. The method of claim8, wherein forming the hard mask comprises: forming an etch stop layeron the preliminary active pattern and a dummy gate layer on the etchstop layer; and partially etching the dummy gate layer and the etch stoplayer to form the hard mask; and wherein the method further comprisesforming a spacer on a side face of the hard mask.
 12. The method ofclaim 11, wherein the spacer has an etch selectivity with respect to thedummy gate layer.
 13. The method of claim 11, wherein trimming the widthof the etched preliminary active pattern to form an active patterncomprises trimming the etched preliminary active pattern to have a widththat is less than the combined width of a lower surface of the hard maskand the spacer.
 14. The method of claim 8, wherein the at least twochannel layers comprise a first semiconductor material, and the at leasttwo gate layers comprise a second semiconductor material that has anetching selectivity with respect to the first semiconductor material.15. The method of claim 14, wherein the first semiconductor materialcomprises silicon, and the second semiconductor material comprisesgermanium or silicon-germanium.
 16. The method of claim 8, whereinforming the source/drain regions further comprises implanting firstimpurities into at least portions of the semiconductor layer grown onthe first and second sidewalls of the active pattern and the top surfaceof the substrate.
 17. The method of claim 16, Thither comprising dopinga top surface portion of the substrate that is positioned beneath thelowest gate layer with second impurities to form a channel isolationregion, wherein the second impurities have a conductivity type that isopposite the conductivity type of the first impurities.
 18. The methodof claim 8, wherein forming the preliminary active pattern comprises:alternatively forming the at least two gate layers and the at least twochannel layers on the substrate; partially etching the at least two gatelayers, the at least two channel layers and the substrate to form anisolation trench defining a field region; and forming a field oxidelayer in the isolation trench.
 19. The method of claim 8, wherein priorto forming the tunnels, the method further comprises: forming a firstinsulation layer on the active pattern, the source/drain layers and thehard mask; selectively removing the hard mask to form a groovepenetrating the first insulation layer; and forming a spacer having anetching selectivity with respect to the first insulation layer on a sideface of the groove.
 20. The method of claim 19, wherein after formingthe upper gate and the lower gate, the method further comprises:selectively removing the first insulation layer; and forming a metalsilicide layer on the tipper gate and on the source/drain regions. 21.The method of claim 8, wherein trimming the width of the etchedpreliminary active pattern comprises isotropically etching thepreliminary active pattern using an etchant that has substantially thesame etching selectivity with respect to both the channel layers and thegate layers.
 22. The method of claim 8, wherein trimming the width ofthe etched preliminary active pattern comprises etching the preliminaryactive pattern using a chemical dry etching process.
 23. The method ofclaim 11, wherein the spacer and the etch stop layer are formed ofsubstantially identical materials.
 24. The method of claim 11, whereinthe etch stop layer comprises silicon nitride, and the dummy gate layercomprises silicon oxide.
 25. The method of claim 8, further comprisingforming a first spacer on a side face of the hard mask and wherein,prior to forming the tunnels, the method further comprises: forming afirst insulation layer on the active pattern, the source/drain regionsand the hard mask; planarizing the first insulation layer to expose asurface of the hard mask; selectively removing the hard mask and thefirst spacer to partially expose an oxide layer in the field region;selectively removing the exposed oxide layer to expose the gate layers.26. The method of claim 8, further comprising forming a metal silicidelayer on the upper gate.
 27. A method of manufacturing a semiconductordevice, the method comprising: forming a stacked structure comprising afirst semiconductor layer on a substrate, a second semiconductor layeron the first semiconductor layer, a third semiconductor layer on thesecond semiconductor layer and a fourth semiconductor layer on the thirdsemiconductor layer; forming a mask pattern on a portion of the fourthsemiconductor layer; etching the first, second, third and fourthsemiconductor layers using the mask pattern as an etching mask to exposeone or more portions of the substrate and to form a preliminary activepattern having sidewalls that are vertically aligned with sidewalls ofthe mask pattern; isotropically etching the preliminary active patternto form an active pattern having a front side, a first sidewall, asecond sidewall, a rear side and a top surface, wherein the activepattern extends above an upper surface of the substrate and wherein thefirst and second sidewalls are substantially vertical; growing asemiconductor layer on the first and second sidewalls of the activepattern to form a pair of source/drain regions; selectively etchingportions of the first and third semiconductor layers to form a pair oftunnels in the active pattern that each extend from the front side ofthe active pattern to the rear side of the active pattern; and forming aconductive gate on the top surface of the active pattern and in thetunnels.
 28. The method of claim 27, wherein the mask pattern comprisesthe combination of a hard mask pattern and at least one spacer on asidewall of the hard mask pattern.
 29. The method of claim 27, whereinthe mask pattern comprises a hard mask pattern.
 30. The method of claim27, wherein isotropically etching the preliminary active pattern to formactive pattern comprise trimming the preliminary active pattern to havea width that is less than a width of the mask pattern.
 31. The method ofclaim 27, wherein the mask pattern has a trapezoidal shape.
 32. Themethod of claim 27, wherein isotropically etching the preliminary activepattern to form an active pattern comprises isotropically etching thepreliminary active pattern using an etchant that has little etchingselectivity between the first, second, third and fourth semiconductorlayers.
 33. The method of claim 27, wherein isotropically etching thepreliminary active pattern to form an active pattern comprisesisotropically etching the preliminary active pattern using a chemicaldry etching process that includes radicals in the etching gas.